1/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r parameters units typical frequency mhz 900 2000 2450 900 2000 2450 2700 gain db 30 18 13 30 18 13 16 s11 db -17 -14 -9 -17 -14 -9 -12 s22 db -7.5 -14 -10 -7.5 -14 -10 -15 output ip3 1) dbm 45 47 46 48 49 48 48 noise figure db 11 5.5 6.8 11.5 5.6 7 5.9 output p1db dbm 32 31.5 32 33 32.5 33 33 supply current ma 930 1150 supply voltage v 4.6 5 * performance tested at 50 ? system and a room temperature. 1) oip3 measured with two tones at an output power of +14 dbm/tone separated by 1 mhz. parameters units min typ max testing frequency mhz 2000 gain db 17 18 s11 db -14 s22 db -14 output ip3 dbm 47 49 noise figure db 5.6 6 output p1db dbm 31.5 32.5 supply current ma 1050 1150 1250 supply voltage v 5 * 100% in-house dc & rf testing is done on packaged products before taping. parameters rating operating case temperature -40 to + 85 c storage temperature -40 to + 150 c supply voltage +6 v operating junction temperature +150 c input rf power (cw, 50ohm matched)* 25 dbm * please find the max. input power data from http://www.asb.co.kr/pdf/maximum_input_power_analysis.pdf features description typical performance* absolute maximum ratings more information tel: (82) 42-528-7223 fax: (82) 42-528-7222 asb inc., 4 th fi. venture town bldg., 367-17 goijeong-dong, seo-gu, daejon 302-716, korea 18 db gain at 2000 mhz 32.5 dbm p1db 49 dbm output ip3 mttf > 100 years two power supplies the ASX621, a power amplifier mmic, has a high linearity, high gain, and high efficiency over a wide range of frequency, being suitable for use in both receiver and transmitter of telecommunication systems up to 3 ghz. the amplifier is available in an soic-8 package and passes through the strin- gent dc, rf, and reliability tests. applications cdma, gsm, w-cdma, pcs gain block catv amplifier if amplifier wibro amplifier bluetooth amplifier wireless lan amplifier product specifications* package style: soic-8 a sx621
2/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r 1) oip3 is measured with two tones at an output power of +15 dbm/tone separated by 1 mhz. board layout (fr4, 40x40 mm 2 , 0.8t) schematic s-parameters application circuit frequency (mhz) 824~849 magnitude s21 (db) 28 magnitude s11 (db) -14 magnitude s22 (db) -8 output p1db (dbm) 32.5 output ip3 1) (dbm) 47 noise figure (db) 11 supply voltage (v) 5 current (ma) 1150 cdma rx 824 ~ 849 +5 v 600 700 800 900 1000 1100 1200 10 15 20 25 30 35 gain (db) frequency (mhz) 600 700 800 900 1000 1100 1200 -25 -20 -15 -10 -5 0 s11 (db) frequency (mhz) 600 700 800 900 1000 1100 1200 -25 -20 -15 -10 -5 0 s22 (db) frequency (mhz) 0 500 1000 1500 2000 2500 3000 3500 0 1 2 3 4 5 stability factor frequency (mhz) vcc=5 v rf in rf out c6=100pf c7=1 f ASX621 d1=5.6v zener diode l1=56 nh (coil inductor) c2=100 pf c1=2.2 pf c4=27 pf c8=100pf c9=1 f c3=7.5 pf 7 mm r1=15 ? c5=15 pf l2=56 nh (coil inductor) *c4 shall be placed as close as possible to the pin.
3/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r 1) oip3 is measured with two tones at an output power of +15 dbm/tone separated by 1 mhz. board layout (fr4, 40x40 mm 2 , 0.8t) schematic s-parameters application circuit frequency (mhz) 869 960 magnitude s21 (db) 31 26 magnitude s11 (db) -13 -18 magnitude s22 (db) -8 -7.5 output p1db (dbm) 32.5 32.5 output ip3 1) (dbm) 47 48 noise figure (db) 11 11 supply voltage (v) 5 5 current (ma) 1150 1150 cdma tx, gsm 869 ~ 960 +5 v 600 700 800 900 1000 1100 1200 10 15 20 25 30 35 gain (db) frequency (mhz) 600 700 800 900 1000 1100 1200 -25 -20 -15 -10 -5 0 s11 (db) frequency (mhz) 600 700 800 900 1000 1100 1200 -15 -10 -5 0 5 s22 (db) frequency (mhz) 0 500 1000 1500 2000 2500 3000 3500 0 1 2 3 4 5 stability factor frequency (mhz) vcc=5 v rf in rf out c6=100pf c7=1 f ASX621 d1=5.6v zener diode l1=56 nh (coil inductor) c2=100 pf c1=2 pf c4=12 pf c8=100pf c9=1 f c3=7.5 pf 6.5 mm r1=15 ? c5=9 pf l2=56 nh (coil inductor) *c4 shall be placed as close as possible to the pin.
4/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r 1) oip3 is measured with two tones at an output power of +14 dbm/tone separated by 1 mhz. board layout (fr4, 40x40 mm 2 , 0.8t) schematic s-parameters application circuit frequency (mhz) 1920~1980 magnitude s21 (db) 18 magnitude s11 (db) -14 magnitude s22 (db) -14 output p1db (dbm) 32.5 output ip3 1) (dbm) 50 noise figure (db) 5.6 supply voltage (v) 5 current (ma) 1150 wcdma rx 1920 ~ 1980 +5 v 500 1000 1500 2000 2500 3000 3500 0 1 2 3 4 5 stability factor frequency (mhz) c2=1.5 pf vcc=5 v rf in rf out c4=100pf c5=1 f ASX621 d1=5.6v zener diode l2=27 nh (coil inductor) c1=2 pf c3=2.2 pf c6=100pf c7=1 f l1=27 nh (coil inductor) l3=1.8 nh 3 mm 1700 1800 1900 2000 2100 2200 0 5 10 15 20 25 gain (db) frequency (mhz) -40 o c 25 o c 85 o c 1700 1800 1900 2000 2100 2200 -30 -25 -20 -15 -10 -5 0 s11 (db) frequency (mhz) -40 o c 25 o c 85 o c 1700 1800 1900 2000 2100 2200 -25 -20 -15 -10 -5 0 s22 (db) frequency (mhz) -40 o c 25 o c 85 o c *c3 shall be placed as close as possible to the pin.
5/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r p1db vs. temperature current vs. temperature output ip3 vs . tone power (frequency = 1950 mhz) gain vs. temperature -60 -40 -20 0 20 40 60 80 100 800 900 1000 1100 1200 1300 1400 current (ma) temperature ( o c) -60 -40 -20 0 20 40 60 80 100 8 12 16 20 24 28 gain (db) temperature ( o c) frequency = 1950 mhz -60 -40 -20 0 20 40 60 80 100 26 28 30 32 34 36 38 p1db (dbm) temperature ( o c) frequency = 1950 mhz 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 0 10 20 30 40 50 60 70 80 output ip3 (dbm) p out per tone (dbm) -40 o c 25 o c 85 o c
6/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r 1) oip3 is measured with two tones at an output power of +14 dbm/tone separated by 1 mhz. board layout (fr4, 40x40 mm 2 , 0.8t) schematic s-parameters application circuit frequency (mhz) 2110~2170 magnitude s21 (db) 17 magnitude s11 (db) -15 magnitude s22 (db) -13 output p1db (dbm) 32.5 output ip3 1) (dbm) 50 noise figure (db) 5.6 supply voltage (v) 5 current (ma) 1150 wcdma tx 2110 ~ 2170 +5 v 1900 2000 2100 2200 2300 2400 -30 -25 -20 -15 -10 -5 0 s11 (db) frequency (mhz) 1900 2000 2100 2200 2300 2400 0 5 10 15 20 25 gain (db) frequency (mhz) 1900 2000 2100 2200 2300 2400 -25 -20 -15 -10 -5 0 s22 (db) frequency (mhz) 0 500 1000 1500 2000 2500 3000 3500 0 1 2 3 4 5 stability factor frequency (mhz) c2=1.2 pf vcc=5 v rf in rf out c4=100pf c5=1 f ASX621 d1=5.6v zener diode l2=27 nh (coil inductor) c1=1.8 pf c3=1.8 pf c6=100pf c7=1 f l1=27 nh (coil inductor) l3=1.8 nh 3 mm *c3 shall be placed as close as possible to the pin.
7/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r 1) oip3 is measured with two tones at an output power of +14 dbm/tone separated by 1 mhz. board layout (fr4, 40x40 mm 2 , 0.8t) schematic s-parameters application circuit frequency (mhz) 2400~2500 magnitude s21 (db) 13 magnitude s11 (db) -9 magnitude s22 (db) -10 output p1db (dbm) 33 output ip3 1) (dbm) 48 noise figure (db) 7 supply voltage (v) 5 current (ma) 1150 wlan 2400 ~ 2500 +5 v 0 500 1000 1500 2000 2500 3000 3500 0 1 2 3 4 5 stability factor frequency [mhz] 1800 2000 2200 2400 2600 2800 3000 0 5 10 15 20 gain (db) frequency (mhz) 1800 2000 2200 2400 2600 2800 3000 -30 -25 -20 -15 -10 -5 0 s22 (db) frequency (mhz) c1=56 pf c3=2 pf vcc=5 v rf in rf out c7=100pf c8=1 f ASX621 d1=5.6v zener diode l1=27 nh (coil inductor) c4=56 pf c2=1.2 pf c6=1.5 pf c9=100pf c10=1 f l2=27 nh (coil inductor) c5=2.2 pf 2.5 mm 1800 2000 2200 2400 2600 2800 3000 -20 -15 -10 -5 0 5 s11 [db] frequency [mhz] *c6 shall be placed as close as possible to the pin.
8/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r 1) oip3 is measured with two tones at an output power of +15 dbm/tone separated by 1 mhz. board layout (fr4, 40x40 mm 2 , 0.8t) schematic s-parameters application circuit frequency (mhz) 2700 2900 magnitude s21 (db) 16 14 magnitude s11 (db) -12 -12 magnitude s22 (db) -15 -15 output p1db (dbm) 33 output ip3 1) (dbm) 48 noise figure (db) 5.9 supply voltage (v) 5 current (ma) 1150 wimax 2700 ~ 2900 +5 v 2500 2600 2700 2800 2900 3000 3100 0 5 10 15 20 25 gain (db) frequency (mhz) 2500 2600 2700 2800 2900 3000 3100 -20 -15 -10 -5 0 s11 (db) frequency (mhz) 2500 2600 2700 2800 2900 3000 3100 -30 -25 -20 -15 -10 -5 0 s22 (db) frequency (mhz) 0 500 1000 1500 2000 2500 3000 3500 0 1 2 3 4 5 stability factor frequency (mhz) c2=1.2 pf vcc=5 v rf in rf out c5=100pf c6=1 f ASX621 d1=5.6v zener diode l1=27 nh (coil inductor) c1=1.5 pf c4=1 pf c7=100pf c8=1 f l2=27 nh (coil inductor) c3=1.2 pf 2.5 mm *c4 shall be placed as close as possible to the pin.
9/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r 1) oip3 is measured with two tones at an output power of +14 dbm/tone separated by 1 mhz. board layout (fr4, 40x40 mm 2 , 0.8t) schematic s-parameters application circuit frequency (mhz) 1200 1300 1400 magnitude s21 (db) 25.5 23 20 magnitude s11 (db) -14 -12 -7 magnitude s22 (db) -10 -9 -7 output p1db (dbm) 31 32.5 31 output ip3 1) (dbm) 48 48 47 noise figure (db) 9.5 9.5 9.5 supply voltage (v) 5 5 5 current (ma) 1150 1150 1150 1200 ~ 1400 +5 v vcc=5 v rf in rf out c6=100pf c7=1 f ASX621 d1=5.6v zener diode l1=39 nh (coil inductor) c2=100 pf c1=3 pf c4=8 pf c8=100pf c9=1 f c3=5 pf 3.5 mm r1=10 ? c5=4.7 pf l2=39 nh (coil inductor) 2.5 mm 1000 1100 1200 1300 1400 1500 1600 0 5 10 15 20 25 30 35 gain (db) frequency (mhz) 1000 1100 1200 1300 1400 1500 1600 -20 -15 -10 -5 0 s11 (db) frequency (mhz) 1000 1100 1200 1300 1400 1500 1600 -20 -15 -10 -5 0 5 s22 (db) frequency (mhz) 0 500 1000 1500 2000 2500 3000 3500 0 1 2 3 4 5 stability factor frequency (mhz)
10/10 asb inc. ? sales@asb.co.kr ? tel: +82-42-528-7223 august 2009 as x 621 dc-3000 mhz mmic amplifie r (unit: mm) pin no. function pin no. function. 1 2nd stage rf in 5 gnd 2 1st stage rf out 6 2nd stage rf out 3 gnd 7 2nd stage rf out 4 1st stage rf in 8 gnd mounting recommendation (in mm) outline drawing dimensions (in mm) symbols min nom max a 1.40 1.50 1.60 a1 0.00 -- 0.10 a2 -- 1.45 -- b 0.33 -- 0.51 c 0.19 -- 0.25 d 4.80 -- 5.00 e1 3.80 3.90 4.00 e -- 1.27 -- e 5.80 6.00 6.20 l 0.40 -- 1.27 y -- -- 0.10 0 -- 8 l1 0.95 1.05 1.15 note: 1. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 2. to ensure reliable operation, device gr ound paddle-to-ground pad sol dering is critical. 3. add mounting screws near the part to fast en the board to a heat sinker. ensure that the ground / thermal via region contacts the heat sinker. 4. a proper heat dissipati on path underneath the area of the pcb for the mounted device is strictly required for proper thermal operation. damage to the device can result from inappropriate heat dissipation. esd classification hbm class 1b voltage level: 500 v~1000 v mm class a voltage level: <200 v caution: esd-sensitive device! moisture sensitivity level (msl) level 3 at 260 c reflow
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